![]() Align the Individual PZT or BSPT Crystals Along the Same Axis by Poling the Elements.Screen Print the Outer Electrodes on the Elements.Lap the Elements to Achieve Tight Dimensional Tolerances: ±5 µm for Each Element.Sinter the Elements to Fuse the Piezoelectric Pressed Powder and Grow PZT or BSPT Crystals.Purge Solvent and Binder Material Residues by Heat Treating the Elements.Dice the Block into Individual Elements.Consolidate the Layered Sheets in an Isostatic Press.Layer the Printed Sheets One Top of Another.Screen Print Electrodes on Each Individual Sheet.Build Blocks from Flexible Sheets of Lead Zirconate Titanate (PZT) or BiScO 3-PbTiO 3 (BSPT) Powder.For more information about our manufacturing process and capabilities, please see our Piezoelectric Capabilities page. A glimpse into the fabrication of our piezoelectric chips follows. This allows us to economically produce high-quality products, including custom and OEM devices. Our piezoelectric chips are fabricated in our production facility in China, giving us full control over each step of the manufacturing process. Please contact Tech Support for more information.Ĭhips After Binder Burnout and Sintering Thorlabs' In-House Piezoelectric Manufacturing Additionally, we support high-volume orders. Piezoelectric chips with custom dimensions, voltage ranges, and coatings are available. Please see the Operation tab for information on interfacing piezoelectric actuators with loads, special operational considerations, and data that will allow the lifetimes of these actuators to be estimated when their operational conditions are known. In addition, Thorlabs offers conical end cups, which are compatible with ball contacts possessing diameters between 1.5 mm to 7.0 mm. To accommodate a variety of loading conditions, flat ceramic or hemispherical ceramic endplates may be purchased as accessories for these chips. For convenience, many of our products ship with 75 mm wires soldered to these two sides. The positive side will be denoted with either a silver "+" or by a black dot. Screen-printed silver electrodes are printed on the chip, to which the drive voltage is applied. The ceramic layer offers better protection against moisture than an epoxy coating. The areas of these chips without electrodes are coated with a ceramic layer that acts as a barrier against moisture. For a complete list of specifications, see the tables below. For applications that are less sensitive, the 100 V and 150 V options have longer lifetimes. When your application is highly sensitive to voltage, consider our chips with maximum drive voltages of 45 V or 75 V. Our piezoelectric chips are available with one of four drive voltage ranges: 0 - 45 V, 0 - 75 V, 0 - 100 V, or 0 - 150 V. Please see the Operation tab for additional information.Įlectrodes are included on each layer of the chip, as this minimizes the voltage required to drive them. The actual value of the maximum displacement varies for each item and must be experimentally determined however, the maximum displacement will always be larger than the free stroke displacement. The maximum displacement of these actuators is achieved when they are preloaded with the maximum displacement load, which is specified for each product. These actuators are characterized by precision movement and produce free stroke (unloaded conditions) displacements from 0.7 µm to 6.1 µm. Chips made from both PZT and BSPT piezoelectric ceramic are available, with operating temperatures up to 130 ☌ for PZT chips and 250 ☌ for BSPT chips. The compact multilayer design results in chips with high resonant frequencies (160 kHz - 1350 kHz) and sub-millisecond response times. Electrodes are printed on each sheet before they are layered, and a precision lapping process ensures the height tolerance of each chip is better than ±5 µm. ![]() Thorlabs' piezoelectric actuators are fabricated from layered sheets of piezoelectric ceramic as is shown in the diagram at upper right and described in the Thorlabs' In-House Piezoelectric Manufacturing box below. End Hemispheres and Flat End Plates also Available Separately.Many Chips Available with Pre-Attached Wires.BiScO 3-PbTiO 3 (BSPT) Chips Offered for Temperatures up to 250 ☌.Maximum Operating Temperature of 130 ☌ for Lead Zirconate Titanate (PZT) Chips.Custom Options Available by Contacting Tech Support.Mounting Face Dimensions from 0.9 mm x 0.9 mm to 10.0 mm x 10.0 mm. ![]()
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